Which of the following is the term used to describe the aggregation of multiple components to formone logical component?（）A、BondingB、Circuit switchingC、CSMA/CDD、Channelization
Which of the following is the term used to describe the aggregation of multiple components to formone logical component?（）
A、Bonding
B、Circuit switching
C、CSMA/CD
D、Channelization
发布时间：2024-09-05 21:18:02
